Tuag Bonder rau LED

Tuag Bonder rau LED

Kev sib khi tuag yog cov txheej txheem ntawm kev kho cov wafer nti ntawm lub substrate lossis pob.This HWS100-N siab precision tuag bonder yog qhov tseeb siab rau cov khoom siv LED, haum rau SMD020, 1010, 2121, 2835, teeb filament, thiab COB thiab lwm yam.
Xa kev nug

LED Die Bonder HWS100-N

 

Kev piav qhia

 

Kev sib khi tuag yog txheej txheem ntawm kev kho cov wafer nti ntawm lub substrate lossis pob.

Qhov no HWS100-N siab precision tuag bonder yog qhov raug siab rau cov khoom siv LED, haum rau SMD020, 1010, 2121, 2835, teeb filament, thiab COB thiab lwm yam. Cov cuab yeej nta automated tuav ntawm chips thiab substrates. Lub sijhawm voj voog yog mus txog 65ms.

High-precision tuag bonder tshuab thiab cov txheej txheem tswj kev siv tshuab ua kom zoo thiab ua haujlwm zoo.

 

Nta

 

  • Kev txais yuav cov high-precision dual bonding lub taub hau, dual dispensing, thiab dual wafer searching systems.
  • Txais siv lub cev muaj zog tsav lub wafer searching platform (X / Y) thiab noj platform (B / C).
  • Txais yuav tsis siv neeg loading thiab unloading system kom txo tau lub sij hawm hloov.
  • Txais kev tsav tsheb ncaj qha los tsav lub taub hau sib txuas.
  • Txais yuav programmable qhov kub thiab txias dispensing system.
  • High precision dispensing pab pawg, nrog kua nplaum muaj nuj nqi.
  • Nrog kev tshawb pom muaj nuj nqi ua ntej thiab tom qab muab ob npaug rau.
  • Nrog kev ua haujlwm ntawm cov kua nplaum qhov loj me thiab txoj haujlwm tsis siv neeg them nyiaj.
  • Nrog ob qho tib si dipping thiab dispensing kua nplaum system.
  • Nrog lub tshuab nqus tsev to kom pom muaj nuj nqi.
  • High efficiency thiab productivity.
  • Lub tshuab computer tswj kev ua haujlwm ntawm cov cuab yeej siv, ua kom yooj yim rau kev ua haujlwm ntawm cov cuab yeej siv tshuab

 

Tsis muaj

 

Qauv

HWS100-N

Lub sij hawm ntau lawm

65ms (nyob ntawm seb qhov ntau thiab tsawg nti thiab tuav)

X/Y qhov tseeb

± 1mil (± 0}.025mm)

Kev sib hloov

± 3 degree (xaiv)

Chip dimension

3 x 3mil - 800x80mil

Max lub kaum sab xis kho

± 15 degree

Max wafer loj

6 "(152mm) sab nraud txoj kab uas hla

Kev daws teeb meem

1μm ({1}}.04mil)

Thimble Z stroke

2 hli

Bonding system

Swing arm-and-hand system

Duab paub grey scale

256 qib grey

Duab daws teeb meem

720 x 540 px

Chip absorbing siab

30-250g

Kho qhov ntev

110-300 hli

Fixture dav

50-100 hli

Fais fab mov

AC 220V 50HZ Cov

Rated zog

Kwv yees li. 1.6 KW TSI

Kev siv cua

40L / min

Huab cua

0.5Mpa

 

Cim npe nrov: tuag bonder rau coj, Tuam Tshoj tuag bonder rau coj manufacturers, hoobkas