Tuag Bonder rau Semiconductor

Tuag Bonder rau Semiconductor

Ib tug tuag bonder yog ib tug system uas tso ib tug semiconductor ntaus ntawv mus rau qib tom ntej ntawm kev sib txuas, txawm nws yog ib tug substrate los yog ib tug luam Circuit Court board. Nws yog cov txheej txheem ntawm kev kho cov wafer nti ntawm lub substrate lossis pob.
Xa kev nug

Tuag Bonder HW812 rau IC / IC Ncej

 

Kev piav qhia

 

Ib tug tuag bonder yog ib tug system uas tso ib tug semiconductor ntaus ntawv mus rau qib tom ntej ntawm kev sib txuas, txawm nws yog ib tug substrate los yog ib tug luam Circuit Court board. Nws yog cov txheej txheem ntawm kev kho cov wafer nti ntawm lub substrate lossis pob.

 

HW812 high precision tuag bonder yog qhov tseeb siab rau nti-rau-chip thiab chip-rau-wafer bonding, ntawm wafers txog 12".

Nws yog sib xws nrog IC ncej.

 

Nta

 

  • Dual dispensing system siv tus qauv ntsia hlau.
  • High precision linear tsav khoom siv lead ua khi lub taub hau, lub suab coil torque nplhaib kom raug tswj cov khoom siv lead ua siab.
  • High-precision nrhiav nti platform, servo tsav-tsav nti lub kaum sab xis kho qhov system, nruab nrog 12 "wafer tsis siv neeg zaj duab xis nthuav dav.
  • Txais kev faib tawm kev tswj hwm kev ywj pheej, kev tswj xyuas cov kua nplaum ntau dua.
  • Vertical dispensing adopts high-precision grating nyeem lub taub hau qhov siab ntsuas, Z-axis linear tsav tsav, ua ntej thiab tom qab kev tshawb pom ntawm dispensing siv lub koob yees duab ntsug nrhiav hom, txhawm rau txhim kho qhov tseeb ntawm kev tshawb pom ntawm cov kua nplaum.
  • Kev ywj pheej XYZ axis mechanism.
  • Txhim kho cov neeg ua haujlwm siab precision dispensing.
  • Nrog kev kos duab ua haujlwm.
  • Nrog ua ntej dispensing, tom qab dispensing nrhiav tau muaj nuj nqi.
  • Glue qhov chaw loj thiab txoj haujlwm tsis siv neeg them nyiaj ua haujlwm.
  • Vacuum to detection.
  • Cov khoom siv automation raug txhim kho kev tsim khoom, txo tus nqi.

 

Tsis muaj

 

Qauv

HWV 812

UPH

Max 17K

Qhov tseeb

±20μm

Kev sib hloov

± 3 degree

Chip dimension

15 x 15 - 200x 200mil

Max lub kaum sab xis kho

± 15 degree

Max wafer loj

12"

X/Y daws teeb meem

1μm

Thimble Z stroke

3mm ib

Donder taub hau

Linear motor tsav, lub taub hau tig

Chip absorbing siab

30-300g

Kho qhov ntev

110-300 hli

Fixture dav

25-110 hli

Fais fab mov

AC 220V 50HZ Cov

Huab cua

0.5Mpa

 

Cim npe nrov: Tuam Tshoj tuag bonder rau semiconductor, Tuam Tshoj tuag bonder rau semiconductor manufacturers, hoobkas