Kev kub ceev Hlau Bonder HW585 rau IC
Kev piav qhia
Hlau bonding tshuab yog cov txheej txheem ntawm kev sib txuas ntawm ib qho kev sib txuas ntawm ib qho kev sib txuas (IC) lossis lwm yam khoom siv semiconductor thiab nws cov ntim thaum lub sij hawm tsim khoom semiconductor. Kev sib txuas ntawm hlau feem ntau suav hais tias yog qhov siv tau zoo tshaj plaws thiab hloov tau yooj yim interconnect technology.
HW585 IC high-speed hlau bonder no tsuas yog rau cov khoom siv hluav taws xob sib txuas (IC), suav nrog SOT, SOP, SSOP, TSSOP, DFN, QFN, QFP, BGA, COB, Optocoupler, thiab lwm yam nrog lub sijhawm voj voog ntawm 40ms / hlau thiab siab raug. Muaj feem xyuam rau cov khoom siv hlau sib txawv: kub / nyiaj / alloy / tooj liab hlau.
Nta
- Nrog siab UPH, txhawb nqa ncej mus txog 100mm nyob rau hauv dav, nce efficiency thiab productivity.
- Qhov no yog cov qauv kev ua haujlwm siab rau IC cov khoom, nqa kev kub ceev thiab precision hauv txhua yam.
- Nruab nrog dual-frequency ultrasonic transducer, siab thiab tsawg zaus hloov tau yooj yim, zoo heev txhim kho khoom adaptability.
- Piezoelectric ceramic lub teeb yuag clamps, nce ceev, tsis tas yuav tsum tau hloov mus rau ntau yam hlau diameters.
- Tag nrho tsis siv neeg kub adaptive system rau txhim kho vuam precision.
- Cov ntse ntse, siab-rhiab heev BSD system kom yooj yim dua.
- Tus kheej-tsim HMC cov lus tsa suab tswj qhov system los txhim kho qhov raug thiab ruaj khov ntawm cov khoom tsim tawm. (Tshiab ultra-siab ceev XY tsab ntawv tsa suab platform, ceev, ruaj khov thiab huab cua-txuag)
Tsis muaj
|
Muaj peev xwm |
Lub sijhawm voj voog |
40ms / xov |
|
Bonding raug |
±2μm |
|
|
Hlau txoj kab uas hla |
Φ15μm-Φ50μm |
|
|
XY Tab |
Tsav Mechanism |
Linear motor tsav |
|
XY daws teeb meem |
50nm ua |
|
|
Qhov chaw sib khi |
X: 56mm, Y: 90mm |
|
|
PR qhov system |
Ib txoj kev kho qhov muag (optical ob txoj kev kho qhov muag / programmable autofocus) |
|
|
Khoom siv tuav system |
Kov Mechanism |
Vertical pawg |
|
No. ntawm cov ntawv xov xwm |
2-3 |
|
|
Siv tau cov ntawv xov xwm |
Ntev |
95-300 hli |
|
Dav |
28-100 hli |
|
|
Thickness |
{0}}07-2.0mm |
Cim npe nrov: Hlau bonder rau ic, Tuam Tshoj hlau bonder rau ic manufacturers, hoobkas
